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X9 horizontal/vertical rotation board Compact for Hungary Buyers - Wholesale Commercial Display and
X9 horizontal/vertical rotation board Compact for Hungary Buyers - Wholesale Commercial Display and

X9 horizontal/vertical rotation board Compact for Hungary Buyers - Wholesale Commercial Display and

Date:2026-09-24
  • Desc:horizontal/vertical rotation board Commercial Display and Information Publishing Boards Hungary export OEM ODM wholesale
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    X9 horizontal/vertical rotation board Compact for Hungary Buyers - Wholesale Commercial Display and Information Publishing Boards from China Source Factory

    As of September 24, 2026, the X9-CD110 leaves Shenzhen for Hungary importers under Wanlin Group's 2026 Commercial Display and Information Publishing Boards export program, shipping with Allwinner A133 quad-core SoC (X9 board platform), 1GB LPDDR4 + 16GB eMMC, Hardware 4K@30fps H.265 / H.264 / VP9 decode, Android 10 / Android 12, LVDS plus MIPI panel drive: Commercial Display and Information Publishing Boards, X9-CD110, 1GB LPDDR4 + 16GB eMMC, with commercial panels driven over LVDS or MIPI with publishing software, mixed media formats and rotation handling run directly on the board instead of an external scaler, configured to the needs of Commercial Display and Information Publishing Boards. Wanlin Group as the X9 Android board supplier, exporter and original manufacturer now serves local partners, regional exclusive distributors and strategic OEM clients in more than 60 destination markets, and the Commercial Display and Information Publishing Boards program is open to Hungary buyers ordering at factory-direct terms.

    Core parameters: Allwinner A133 quad-core SoC (X9 board platform), 28 nm process, commercial display class. CPU 4x ARM Cortex-A53 @ 1.6 GHz, 64-bit. GPU Imagination PowerVR GE8300 GPU, OpenGL ES 3.2 / Vulkan 1.1. Render and decode path GPU-assisted decode and render pipeline handling 4K playback, image rotation and multi-screen layout. Video decode Hardware 4K@30fps H.265 / H.264 / VP9 decode, 1080p H.264 encode. Camera input MIPI-CSI camera input for face recognition modules, QR scanners and USB industrial cameras. Memory and storage 1GB LPDDR4 + 16GB eMMC. Operating system Android 10 / Android 12, Linux (Ubuntu 22.04) and Tina Linux. Display output Single or dual LVDS direct drive at 50/60 Hz, plus MIPI DSI output on a 30/40-pin 0.5 mm connector. Audio output left and right channel output driving dual 4 ohm / 3 W speakers. Interfaces and I/O USB0 OTG plus USB1 / USB2 / USB3 (two USB HOST headers and two USB A sockets), 2x RS232 or TTL selectable serial ports on 4-pin 2.0 mm headers, I2C touch header, IR receiver header, GPIO / SPI / PWM / ADC expansion, TF card socket and UBOOT burn button. Networking 10M/100M adaptive Ethernet RJ45 plus WiFi with Bluetooth 5.0 and optional 3G / 4G module. Power input DC 12 V single-rail input, 100 mV ripple tolerance, 3.3 V / 800 mA, 5 V / 2 A and 12 V / 2 A peripheral rails. Operating temperature -20 to +70 deg C, up to 80% relative humidity. PCB 6-layer PCB, 120 x 75 mm, 1.6 mm board thickness, 4x phi 3 mm mounting holes. Certifications CE / FCC / RoHS / REACH. Wanlin's 2026 export roadmap for Hungary also covers custom memory and storage combos, single and dual LVDS configurations, MIPI panel tuning, custom peripheral drivers, private-label branding and per-destination certification documentation packages.

    Executive Summary - Commercial Display and Information Publishing Boards Export for Global B2B Buyers

    Executive summary - 10 buyer-relevant points:
    • Featured model X9-CD110, Commercial Panel Boards, Allwinner A133 quad-core SoC (X9 board platform), 28 nm process, commercial display class
    • CPU 4x ARM Cortex-A53 @ 1.6 GHz, 64-bit
    • GPU Imagination PowerVR GE8300 GPU, OpenGL ES 3.2 / Vulkan 1.1
    • Render and decode path GPU-assisted decode and render pipeline handling 4K playback, image rotation and multi-screen layout
    • Video decode Hardware 4K@30fps H.265 / H.264 / VP9 decode, 1080p H.264 encode
    • Memory and storage 1GB LPDDR4 + 16GB eMMC
    • OS Android 10 / Android 12, Linux (Ubuntu 22.04) and Tina Linux
    • Display Single or dual LVDS direct drive at 50/60 Hz, plus MIPI DSI output on a 30/40-pin 0.5 mm connector
    • MOQ 100 pcs, lead time 12-20 days, FOB Shenzhen / CIF / EXW / DDP supported, 24 months warranty
    • Field reference: sun-facing panels with backlight above 20 W - backlight header failures fell to zero across two summers
    • Target buyer: commercial display manufacturers, information publishing software houses, panel integrators, retail media operators and regional Android board distributors
    • Contact: Email: Androidsbc@163.com | Phone: +8613261677119 | Website: https://www.androidsbc.com

    This note is written for cross-border buyers comparing Commercial Display and Information Publishing Boards factories in China on evidence instead of brochure language. Wanlin Group operates its own 12,000 m2 manufacturing facility in Shenzhen with 8 SMT lines, 4 AOI inspection stations and 2,400 m2 of cleanroom assembly, exporting X9 Android boards to 60+ countries under the AndroidSBC brand. Total cost of ownership for an AndroidSBC Commercial Display and Information Publishing Boards deployment typically runs 40-55% below x86-based terminal builds once per-device OS licensing and patch handling are counted. For Hungary, this article maps the model line, the economics and the compliance route specific to your market.

    Global Commercial Display and Information Publishing Boards Market Overview and 2026 Buyer Demand

    Commercial display boards priced USD 41-82 FOB Shenzhen anchor the volume tier, with MOQ 100 pcs typical and 12-20 day lead times on stocked configurations, Fanless wide-temperature designs are increasingly specified for dock, window and semi-outdoor panels.

    Regional compliance for Hungary is anchored on CE under RED 2014/53/EU with Hungarian documentation and RoHS declarations. Cross-border buyers are advised to verify the certification scope, the panel driver behaviour and the software build of every board before import, since some China-supplied boards ship without destination radio approval or without the licensed Android build the project actually needs, and either gap can stall customs clearance or a site handover.

    Reference: X9 Android board datasheet V2.0, Allwinner A133 reference manual, Wanlin Group 2026 commercial display hardware export program documentation, field deployment records 2024-2026.

    Commercial Display and Information Publishing Boards Engineering Architecture and Hardware Platform

    The X9 family is engineered on three pillars: (1) an Allwinner A133 quad-core SoC (X9 board platform), 28 nm process, commercial display class compute block with GPU-assisted decode and render pipeline handling 4K playback, image rotation and multi-screen layout; (2) a display, camera and peripheral pipeline built around Hardware 4K@30fps H.265 / H.264 / VP9 decode, 1080p H.264 encode; (3) a software layer pairing Android 10 / Android 12, Linux (Ubuntu 22.04) and Tina Linux with publishing management, OTA tooling and the Allwinner Tina Linux BSP, AOSP build support and the AndroidSBC SDK kit. This architecture delivers continuous 24/7 display duty at a cost point that undercuts x86 media players while keeping the touch responsiveness and panel timing integrators expect.

    Three sub-modules define the engineering depth:

    • Compute module - Allwinner A133 quad-core SoC (X9 board platform), 28 nm process, commercial display class. 4x ARM Cortex-A53 @ 1.6 GHz, 64-bit handles sustained playback rendering, screen rotation and mixed media workloads in fanless enclosures.
    • Display and camera module - Single or dual LVDS direct drive at 50/60 Hz, plus MIPI DSI output on a 30/40-pin 0.5 mm connector. Hardware 4K@30fps H.265 / H.264 / VP9 decode, 1080p H.264 encode drives LVDS and MIPI panels directly, and the camera path serves face recognition modules, QR scanners and USB industrial cameras.
    • Peripheral and management module - USB0 OTG plus USB1 / USB2 / USB3 (two USB HOST headers and two USB A sockets), 2x RS232 or TTL selectable serial ports on 4-pin 2.0 mm headers, I2C touch header, IR receiver header, GPIO / SPI / PWM / ADC expansion, TF card socket and UBOOT burn button. Headless operation is supported for display-only units fed over the site network, and the toolchain covers Allwinner Tina Linux BSP, AOSP build support and the AndroidSBC SDK kit, OTA upgrade, boot logo customization, pre-installed app support and launcher customization for remote fleet management.

    Mechanically the board is a 6-layer PCB, 120 x 75 mm, 1.6 mm board thickness, 4x phi 3 mm mounting holes, which is why it drops into enclosures originally drawn around a larger player box without a tooling change.

    Featured Model - X9-CD110 Compact Technical Signature

    The featured model is X9-CD110, part of the Commercial Panel Boards family, configured in this batch with 1GB LPDDR4 memory and 16GB eMMC storage. FOB Shenzhen reference price is $58.50 per piece at MOQ 100 pcs, with bulk tier pricing from $50.31 to $65.52 depending on memory and storage combination, regional certification and packaging artwork. Lead time is 12-20 days from PO confirmation and 30% T/T deposit receipt, with a 24-month warranty.

    The technical signature of X9-CD110 on this configuration is documented below. Every parameter is verified by our Shenzhen lab against the panel specifications of mainstream LCD vendors, the electrical limits of IEC / UL 62368-1 and the serial timing requirements of scanners, printers and lock controllers.

    SpecificationValue
    soc_platformAllwinner A133 quad-core SoC (X9 board platform), 28 nm process, commercial display class
    cpu_core4x ARM Cortex-A53 @ 1.6 GHz, 64-bit
    gpu_3dImagination PowerVR GE8300 GPU, OpenGL ES 3.2 / Vulkan 1.1
    render_decode_pathGPU-assisted decode and render pipeline handling 4K playback, image rotation and multi-screen layout
    video_decodeHardware 4K@30fps H.265 / H.264 / VP9 decode, 1080p H.264 encode
    camera_inputMIPI-CSI camera input for face recognition modules, QR scanners and USB industrial cameras
    memory_storage1GB LPDDR4 + 16GB eMMC
    os_androidAndroid 10 / Android 12, Linux (Ubuntu 22.04) and Tina Linux
    display_outSingle or dual LVDS direct drive at 50/60 Hz, plus MIPI DSI output on a 30/40-pin 0.5 mm connector
    audio_outleft and right channel output driving dual 4 ohm / 3 W speakers
    interfaces_ioUSB0 OTG plus USB1 / USB2 / USB3 (two USB HOST headers and two USB A sockets), 2x RS232 or TTL selectable serial ports on 4-pin 2.0 mm headers, I2C touch header, IR receiver header, GPIO / SPI / PWM / ADC expansion, TF card socket and UBOOT burn button
    networking10M/100M adaptive Ethernet RJ45 plus WiFi with Bluetooth 5.0 and optional 3G / 4G module
    power_inputDC 12 V single-rail input, 100 mV ripple tolerance, 3.3 V / 800 mA, 5 V / 2 A and 12 V / 2 A peripheral rails
    electrical_limits300 mA typical working current (500 mA max), 10 mA typical standby (15 mA max), 350 mA USB supply
    environment-20 to +70 deg C, up to 80% relative humidity
    pcb_mechanics6-layer PCB, 120 x 75 mm, 1.6 mm board thickness, 4x phi 3 mm mounting holes
    certificationsCE / FCC / RoHS / REACH
    use_casecommercial panels driven over LVDS or MIPI with publishing software, mixed media formats and rotation handling run directly on the board instead of an external scaler

    Commercial Display and Information Publishing Boards Application Scenarios across Deployment Sites

    The Commercial Display and Information Publishing Boards below are running in live deployments. Each line names the site, the fleet size and a measured result rather than a capability claim.

    Scenario 1: sun-facing panels with backlight above 20 W (Valletta, Malta). A hospitality group deployed 31 window and terrace units where any backlight over 20 W runs from its own power board, leaving the 6-pin backlight header inside its rated range. Measured result: backlight header failures fell to zero across two summers and panel warranty claims dropped 52%.

    Scenario 2: 4K loop walls in an electronics showroom (Busan, Korea). A retailer fitted 22 units decoding 4K@30fps H.265 loops locally, avoiding the external decoder box the previous build needed and cutting one power supply per screen. Measured result: per-screen hardware cost dropped 37% and playback stutter complaints fell to zero.

    Scenario 3: scheduled publishing across a mine-site camp (Perth, Australia). A facilities operator installed 47 units on a weekly content plan with TF card fallback and scheduled power off during shift change, so the publishing server never has to reach every screen in real time. Measured result: bandwidth per screen per week fell 79% and missed content windows dropped to zero.

    Scenario 4: mixed panel estate driven from one board revision (Antwerp, Belgium). A display integrator standardised 210 panels across LVDS 15-pin and MIPI 30-pin on the same board, setting the panel power jumper per model at assembly and storing the screen file on the eMMC so a swap needs no re-tuning. Measured result: panel swap time on site fell 68% and wrong-jumper returns dropped to zero.

    Scenario 5: dual LVDS panels in a showroom counter (Guadalajara, Mexico). A furniture retailer fitted 16 counters driving two 21.5-inch panels from dual LVDS at independent resolutions, one for the catalogue and one for the financing offer. Measured result: second-screen hardware cost dropped 41% and counter cable count fell from seven to three.

    AndroidSBC Commercial Display and Information Publishing Boards Competitive Advantages for Cross-Border Buyers

    The X9 board and the wider AndroidSBC commercial display portfolio deliver eight advantages for cross-border B2B buyers sourcing from Chinese manufacturers:

    1. Source-factory pricing - Wanlin operates the SMT lines, so FOB Shenzhen pricing runs 40-55% below western-branded x86 media players with no per-device licence fee.
    2. Panel interface coverage - single and dual LVDS direct drive at 50/60 Hz plus MIPI DSI on 30-pin and 40-pin connectors, with panel power selected by jumper, because the panel is the first thing an installer gets wrong.
    3. Touch coverage with no debugging - capacitive, resistive, infrared and optical touch panels up to 20 points report as HID, so a touch layer swaps without driver work at the site.
    4. Peripheral driver coverage - barcode and QR scanners, NFC and IC card readers, password keyboards, fingerprint readers, ID card readers, thermal printers and cameras ship with tested drivers and demo test programs.
    5. Playback and publishing depth - loop, timed and interrupt playback modes with RTC-backed scheduling, plus support for the mainstream publishing software already used in the trade.
    6. Counter-grade I/O - USB0 OTG plus USB1 / USB2 / USB3 (two USB HOST headers and two USB A sockets), 2x RS232 or TTL selectable serial ports on 4-pin 2.0 mm headers, I2C touch header, IR receiver header, GPIO / SPI / PWM / ADC expansion, TF card socket and UBOOT burn button, covering serial peripherals, GPIO relay and lock control, powered USB rails and wide-voltage input for 24-hour sites.
    7. Multi-OS flexibility - Android 10 / Android 12, Linux (Ubuntu 22.04) and Tina Linux, so Android publishing projects and Linux controller builds run on one board.
    8. Continuous-duty reliability - hardware watchdog, RTC, scheduled power on and off, auto-restart after power failure and 7x24 duty from -20 deg C to 70 deg C.

    Combined, these advantages let AndroidSBC partners win display, signage, retail, access and industrial tenders, self-service programmes and private-label projects, secure regional distribution rights, and serve end customers under their own brand at a landed cost 35-45% below legacy suppliers.

    Commercial Display and Information Publishing Boards Certifications, Electrical Performance and Assembly Notes

    The X9-CD110 carries CE / FCC / RoHS / REACH as standard scope. Optional add-on documentation available on request includes UKCA, KC, PSE, SAA, RCM and EAC packs, country-specific declaration templates and UL 62368-1 test reports. All boards are produced in an ISO 9001:2015 and ISO 14001:2015 certified factory with RoHS and REACH declarations issued per batch.

    Electrical performance measured at the bench: 12 V input with 100 mV ripple tolerance, 300 mA typical working current rising to 500 mA maximum with panel and peripherals, 10 mA typical standby rising to 15 mA, 350 mA available on the USB supply, and peripheral rails rated at 3.3 V / 800 mA, 5 V / 2 A and 12 V / 2 A. The board is specified for -20 to +70 deg C, up to 80% relative humidity, which covers unheated lobbies, dock doors and semi-outdoor enclosures without a fan.

    Assembly and integration notes from chapter 5 of the datasheet, which every integration team should run through before closing an enclosure:

    • Match the LVDS panel voltage to the panel power jumper and check the panel current draw before first power-up, also confirming pin 1 direction on the LVDS socket
    • Verify backlight voltage and current, and feed any backlight above 20 W from a separate power board instead of the board backlight header
    • Check peripheral IO levels before wiring USB, serial or GPIO devices, since a mismatched level damages the port rather than the peripheral
    • Confirm serial port level selection and TX / RX wiring, because RS232 and TTL share the same 4-pin header on this board
    • Land the supply on the DC input connector with correct polarity and size the input voltage and current against the total peripheral load
    • Keep the bare board clear of short circuits against the enclosure during assembly
    • Avoid striking board components while fixing, and never force a misaligned screw hole since board deformation cracks BGA joints

    Cross-border buyers should note that public-space hardware compliance combines product marking, radio certification and safety evaluation. For Hungary specifically, importers should confirm CE under RED 2014/53/EU with Hungarian documentation and RoHS declarations before shipment. Wanlin provides a pre-validated compliance package per model with DoC templates, test report copies and label artwork, reducing importer certification lead time from a typical 2-3 months to 1-2 weeks for most markets.

    Commercial Display and Information Publishing Boards Economics, MOQ, Lead Time and Logistics Math

    For a first-time buyer ordering 1,000 pieces of the X9-CD110, the economics stack is:

    Cost LayerUSD per pieceUSD for 1000 pcs
    FOB Shenzhen factory price$58.50$58500.00
    + Sea freight FCL 40HQ (estimated)$3.40$3400.00
    CIF destination port$61.90$61900.00
    + Customs duty 3%-10% (region dependent)$0.84$842.84
    + Local delivery + warehousing$5.60$5600.00
    DDP landed cost$68.34$68340.00

    Sample order cost is USD 60 per SKU refundable against the first bulk order above MOQ. 30% T/T deposit and 70% balance against B/L copy is the standard payment term; L/C at sight is accepted for orders above USD 80,000. Production lead time is 12-20 days, warranty is 24 months, and free DOA replacement applies within 60 days of receipt.

    Commercial Display and Information Publishing Boards FAQ - OEM, ODM, MOQ, Lead Time, Partnership

    Below are eight frequently asked questions from cross-border buyers sourcing X9 Android boards from China. Each answer is anchored on Wanlin's commercial terms, certification scope and field experience across 60+ export markets under the AndroidSBC brand.

    What is the difference between OEM and ODM for Commercial Display and Information Publishing Boards?

    Answer: OEM (Original Equipment Manufacturer) means Wanlin Group builds the X9 board, advertising player or finished commercial terminal under your brand with your PCB silk-screen, logo, packaging and SKU. ODM (Original Design Manufacturer) means we redesign the carrier board, memory and storage combination, I/O set, panel interface, firmware or enclosure around your project. Both run from the same Shenzhen factory and the same firmware team: OEM lead time is 12-20 days and ODM 25-40 days including pre-compliance checks. Schematic review, custom carrier layout, AOSP or Linux build work, panel driver tuning and certification support are provided under NDA.

    Which X9 board should I source for my application?

    Answer: Eight selection rules for cross-border buyers:

    • (1) Advertising players and shopfront screens: X9-AV110 / X9-AV130 with loop, timed and interrupt playback plus a 4K decode path.
    • (2) Commercial panels and publishing software: X9-CD120 / X9-CD140 with LVDS or MIPI panel drive, jumper-selected panel power and in-image rotation.
    • (3) Vending, locker and O2O cabinets: X9-RT120 / X9-RT140 with lock feedback on GPIO, serial printers and offline order queues.
    • (4) Public self-service points: X9-SS130 / X9-SS150 with cloud publishing, staged OTA rollout and offline content caching.
    • (5) Access control and face recognition: X9-AC120 / X9-AC140 with camera bring-up, relay control on GPIO and a local audit trail.
    • (6) Interactive and education panels: X9-IT150 / X9-IT170 with plug-and-play HID touch, multi-point accuracy and rotation handled in the image.
    • (7) Industrial HMI and gateways: X9-IC120 / X9-IC140 with two RS232 or TTL channels, watchdog recovery and -20 to 70 deg C duty.
    • (8) Private-label programmes and redesign work: X9-OD170 / X9-OD180 with carrier redesign, BSP porting, signed firmware, per-unit identity provisioning and a last-time-buy window.

    What software support comes with the boards?

    Answer: Every board ships with the Android 10 image alongside Linux support (Android 10 / Android 12, Linux (Ubuntu 22.04) and Tina Linux), BSP source access, driver documentation, SDK material and OTA tooling. The Android build ships with GMS / Play Store where the destination market and product category qualify; for projects that do not need Google services, the same hardware runs a full AOSP or Linux build, which also lowers unit cost. Kiosk-mode launchers, auto-start app configuration, scheduled power on and off, idle reset for demo units and remote publishing agents are part of the standard integration work. Loop, timed and interrupt playback modes ship enabled, and the media stack covers wmv, avi, flv, rm, rmvb, mpeg, ts and mp4 video with BMP, JPEG, PNG and GIF images.

    How do Wanlin X9 boards compare with x86 media players and proprietary display boxes?

    Answer: Because Wanlin builds the boards rather than reselling them, landed cost typically runs 40-55% below western-branded x86 media players and 25-35% below proprietary commercial display boxes on equivalent panel drive and playback support. On the engineering side, this configuration brings Allwinner A133 quad-core SoC (X9 board platform), 28 nm process, commercial display class, 4x ARM Cortex-A53 @ 1.6 GHz, 64-bit and Imagination PowerVR GE8300 GPU, OpenGL ES 3.2 / Vulkan 1.1, with the BSP covering Android 10 / Android 12, Linux (Ubuntu 22.04) and Tina Linux. Licensing cost also disappears: media PCs carry per-device OS licence fees and patch cycles, while the Android build carries none. The 120 x 75 mm 6-layer board also drops into enclosures that were designed around a player box, which usually removes an external scaler and one power supply per screen.

    Can the board drive LVDS and MIPI panels and the full peripheral set?

    Answer: Yes. Single or dual LVDS direct drive at 50/60 Hz, plus MIPI DSI output on a 30/40-pin 0.5 mm connector. The peripheral stack covers barcode and QR scanners on USB or serial, NFC and IC card readers, PIN pad and password keyboard modules, thermal receipt and label printers, fingerprint readers, ID card readers, cameras on MIPI-CSI or USB, infrared receivers, relays and lock drivers on GPIO, plus speakers, amplifiers and microphones on the audio path and ambient sensors on I2C. Touch panels report as HID, so capacitive, resistive, infrared and optical screens run without field debugging. Drivers ship with the image; if a peripheral is not yet in our driver library, our firmware team writes and validates the driver as part of the ODM scope.

    What are the MOQ, lead time, trade terms, sample policy and warranty?

    Answer: MOQ is 100 pcs per model. Lead time is 12-20 days for standard configurations and 25-40 days for ODM customization. Trade terms are FOB Shenzhen, CIF by sea or air, EXW factory and DDP door-to-door. Payment is 30% T/T deposit with 70% balance against the B/L copy; L/C at sight is accepted above USD 80,000. Samples ship in 1-3 days via DHL Express at USD 60 per SKU, refundable against the first bulk order. Warranty is 24 months, with free DOA replacement within 60 days of receipt.

    Which certifications do the boards carry and what is included for importers?

    Answer: Boards ship with CE / FCC / RoHS / REACH declarations per batch from an ISO 9001:2015 and ISO 14001:2015 certified factory. UKCA, KC, PSE, SAA, RCM, EAC and UL 62368-1 report documentation is available on request, and CE under RED 2014/53/EU with Hungarian documentation and RoHS declarations. We provide DoC templates, test report copies, label artwork and a pre-validated compliance package per model, which shortens importer certification lead time from a typical 2-3 months to 1-2 weeks for most markets. GMS certification support is available where the destination requires Google Play distribution.

    What customization and partnership options does Wanlin offer?

    Answer: Customization scope:

    1. (1) Branding - custom PCB silk-screen, private-label logo on board and enclosure, custom SKU, packaging and boot animation.
    2. (2) Firmware - custom launcher, kiosk lock-down, pre-installed apps, multilingual UI packs, custom boot logo and OTA channel.
    3. (3) Hardware - carrier board redesign, extra serial channels, custom connector maps, memory and storage combinations (1GB-2GB LPDDR4, 8GB-32GB eMMC), single or dual LVDS output, MIPI 30-pin or 40-pin selection, touch panel tuning for PCAP, resistive, IR and optical overlays, 3G / 4G module options and GPIO, SPI, PWM, ADC and I2C expansion.
    4. (4) Software - AOSP build service, Linux BSP porting, panel and peripheral driver development, SDK modules, remote publishing agent integration and playback mode configuration.
    5. (5) Delivery - DDP shipping, FBA or overseas-warehouse labelling, per-batch MAC and serial provisioning.
    Partnership tiers: Authorized Reseller (list price), Regional Distributor (20% off, single-country exclusivity) and Strategic OEM Partner (30% off, multi-country exclusivity, dedicated engineering team).

    Wanlin Global Partner Stories - Real Project References

    AndroidSBC X9 boards have shipped to 60+ countries. The four references below cover 2024-2026 projects, each with city, application and quantified outcome.

    The table below is anonymized by agreement but every row carries a real city, application and quantified outcome from 2024-2026.

    CityApplicationOutcome
    Cordoba, Argentinaboard with a local filing supporta reseller needed local radio filings for a retail media rollout; Wanlin coordinated the filings and delivered pre-validated test copies.
    Bergen, Norwayboard with a low-glare night profilea waterfront operator specified per-panel brightness curves and a night dimming schedule for screens facing residential windows.
    Leipzig, Germanyone board across LVDS and MIPI estatesan integrator runs one image across LVDS and MIPI panel generations, holding a single spare-part SKU across 180 screens.
    Manila, Philippinespanel boards cleared per shipmenta display distributor requires per-shipment conformity certificates; the factory prepares the file with every batch so customs release clears within 48 hours.

    Partnership Models - Authorized Reseller, Regional Distributor, Strategic OEM

    Wanlin offers three partnership tiers for cross-border buyers of Commercial Display and Information Publishing Boards:

    • Authorized Reseller - annual volume USD 20,000+, list price, no exclusivity, standard 24-month warranty, dedicated account manager with a response within 4 business hours.
    • Regional Distributor - annual volume USD 80,000+, 20% off list, single-country exclusivity, co-marketing budget, joint certification cost-share, free BSP and firmware updates for the life of the product.
    • Strategic OEM Partner - annual volume USD 250,000+, 30% off list, multi-country exclusivity, dedicated engineering team, joint roadmap, 18-month price lock and one joint trade-show booth per year at GITEX Global, Smart City Expo World Congress, Canton Fair or the Hong Kong Electronics Fair in Hong Kong, China on a cost-share basis.

    All partners receive free certification documentation and test report copies, custom Android image support, free DOA replacement within 60 days, per-batch MAC and serial provisioning, and a sample programme with USD 60 per SKU refundable against the first bulk order above MOQ.

    Conclusion - How to Start Your Commercial Display and Information Publishing Boards Sourcing Today

    Wanlin Group's 2026 X9 export program is open to B2B buyers, regional distributors, cross-border traders and OEM/ODM partners in Hungary and 60+ destination markets. To start a sourcing discussion, request a quotation or schedule a factory audit in Shenzhen, contact the export team below. Sample orders ship within 1-3 days via DHL Express for in-stock SKUs; custom-configuration samples require 7-15 days. Standard lead time for bulk OEM orders is 12-20 days, and Strategic OEM Partner applications are reviewed quarterly.

    We invite Hungary buyers, export traders and trading companies to build long-term cooperation with Wanlin Group as your China-based OEM/ODM partner, regional exclusive distributor or strategic global supplier under the AndroidSBC brand. Wanlin is the manufacturer behind the X9 board line, the SMT lines and aging rooms behind every batch, and this export program. Let's build the Commercial Display and Information Publishing Boards supply chain together.


    Model: X9-CD110
    Platform: Allwinner A133 quad-core SoC (X9 board platform), 28 nm process, commercial display class
    CPU: 4x ARM Cortex-A53 @ 1.6 GHz, 64-bit
    GPU: Imagination PowerVR GE8300 GPU, OpenGL ES 3.2 / Vulkan 1.1
    Render / decode: GPU-assisted decode and render pipeline handling 4K playback, image rotation and multi-screen layout
    Video: Hardware 4K@30fps H.265 / H.264 / VP9 decode, 1080p H.264 encode
    Camera input: MIPI-CSI camera input for face recognition modules, QR scanners and USB industrial cameras
    Memory: 1GB LPDDR4
    Storage: 16GB eMMC
    OS: Android 10 / Android 12, Linux (Ubuntu 22.04) and Tina Linux
    Display: Single or dual LVDS direct drive at 50/60 Hz, plus MIPI DSI output on a 30/40-pin 0.5 mm connector
    Audio: left and right channel output driving dual 4 ohm / 3 W speakers
    Network: 10M/100M adaptive Ethernet RJ45 plus WiFi with Bluetooth 5.0 and optional 3G / 4G module
    Board I/O: USB0 OTG plus USB1 / USB2 / USB3 (two USB HOST headers and two USB A sockets), 2x RS232 or TTL selectable serial ports on 4-pin 2.0 mm headers, I2C touch header, IR receiver header, GPIO / SPI / PWM / ADC expansion, TF card socket and UBOOT burn button
    Power: DC 12 V single-rail input, 100 mV ripple tolerance, 3.3 V / 800 mA, 5 V / 2 A and 12 V / 2 A peripheral rails
    Temperature: -20 to +70 deg C, up to 80% relative humidity
    PCB: 6-layer PCB, 120 x 75 mm, 1.6 mm board thickness, 4x phi 3 mm mounting holes
    Cert: CE / FCC / RoHS / REACH
    MOQ / Lead / Warranty: 100 pcs / 12-20 days / 24 months
    FOB Shenzhen reference price: $58.50 per piece at MOQ 100 pcs
    Region: Hungary
    Contact: Email: Androidsbc@163.com | Phone: +8613261677119 | Website: https://www.androidsbc.com
    • Wanlin Group, Building B, Building 1, Beisida Medical Device Building, 28 Nantong Avenue, Baolong Community, Baolong Sub-district, Longgang District, Shenzhen, Guangdong, China
    • Manufacturer: Wanlin Group / Brand: AndroidSBC / Site: www.androidsbc.com
    • Export service: Email: Androidsbc@163.com | Phone: +8613261677119 | Website: https://www.androidsbc.com
    • Form factor: Commercial Panel Boards / Platform: Allwinner A133 quad-core SoC (X9 board platform) / PCB: 6-layer PCB, 120 x 75 mm, 1.6 mm board thickness, 4x phi 3 mm mounting holes
    • Country compliance for Hungary: CE under RED 2014/53/EU with Hungarian documentation and RoHS declarations
    tags: LVDS display board Android